▌ Dr. Ramanathan S
Professor
MSB239
srinivar@iitm.ac.in
+91 44 22574171
Personal WebsiteResearch Areas
Electrochemistry, chemical mechanical planarization for semiconductor processing
Professor
MSB239
srinivar@iitm.ac.in
+91 44 22574171
Personal WebsiteResearch Areas
Electrochemistry, chemical mechanical planarization for semiconductor processing
2008 |
Manivannan, R; Ramanathan, S: Role of abrasives in high selectivity STI CMP slurries. Microelectronic Engineering, 85 (8), pp. 1748-1753, 2008, ISSN: 01679317. (Type: Journal Article | Links | BibTeX) @article{Manivannan20081748, title = {Role of abrasives in high selectivity STI CMP slurries}, author = {R Manivannan and S Ramanathan}, url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-48949116077&doi=10.1016%2fj.mee.2008.04.031&partnerID=40&md5=9bcfbc3bffab2e75ff9e5b5f41655027}, doi = {10.1016/j.mee.2008.04.031}, issn = {01679317}, year = {2008}, date = {2008-01-01}, journal = {Microelectronic Engineering}, volume = {85}, number = {8}, pages = {1748-1753}, keywords = {}, pubstate = {published}, tppubtype = {article} } |
2007 |
Prasad, Y N; Ramanathan, S: Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor. Electrochimica Acta, 52 (22), pp. 6353-6358, 2007, ISSN: 00134686, (cited By 61). (Type: Journal Article | Links | BibTeX) @article{Prasad20076353, title = {Chemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor}, author = {Y N Prasad and S Ramanathan}, url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-34249284116&doi=10.1016%2fj.electacta.2007.04.044&partnerID=40&md5=170558e934dd0f9b7a6323b4c51cb126}, doi = {10.1016/j.electacta.2007.04.044}, issn = {00134686}, year = {2007}, date = {2007-01-01}, journal = {Electrochimica Acta}, volume = {52}, number = {22}, pages = {6353-6358}, note = {cited By 61}, keywords = {}, pubstate = {published}, tppubtype = {article} } |
Prasad, Y Nagendra; Ramanathan, S: Insitu characterization of Cu CMP with peroxide based slurries containing arginine as complexing agent. VDE Verlag GmbH, 2007, ISBN: 9783800730650. (Type: Conference | Links | BibTeX) @conference{NagendraPrasad2007209, title = {Insitu characterization of Cu CMP with peroxide based slurries containing arginine as complexing agent}, author = {Y Nagendra Prasad and S Ramanathan}, url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-85092063048&partnerID=40&md5=ddb33775dda42f46006b5c219999fedb}, isbn = {9783800730650}, year = {2007}, date = {2007-01-01}, journal = {ICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings}, pages = {209-214}, publisher = {VDE Verlag GmbH}, keywords = {}, pubstate = {published}, tppubtype = {conference} } |
2006 |
Moganty, S S; S., Ramanathan: The role of arginine as a complexing agent in copper CMP. 914 , 2006. (Type: Conference | Links | BibTeX) @conference{Moganty2006207b, title = {The role of arginine as a complexing agent in copper CMP}, author = {S S Moganty and Ramanathan S.}, url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-33749603416&doi=10.1557%2fproc-0914-f12-03&partnerID=40&md5=9d92c388eb2614e0b07e926e41d03338}, doi = {10.1557/proc-0914-f12-03}, year = {2006}, date = {2006-01-01}, journal = {Materials Research Society Symposium Proceedings}, volume = {914}, pages = {207-212}, keywords = {}, pubstate = {published}, tppubtype = {conference} } |
Prasad, Y Nagendra; Ramanathan, S: Role of amino-acid adsorption on silica and silicon nitride surfaces during STI CMP. Electrochemical and Solid-State Letters, 9 (12), pp. 337-339, 2006, ISSN: 10990062. (Type: Journal Article | Links | BibTeX) @article{NagendraPrasad2006337, title = {Role of amino-acid adsorption on silica and silicon nitride surfaces during STI CMP}, author = {Y Nagendra Prasad and S Ramanathan}, url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-33750472661&doi=10.1149%2f1.2351957&partnerID=40&md5=f47ebc02b680385489244a281bc485ff}, doi = {10.1149/1.2351957}, issn = {10990062}, year = {2006}, date = {2006-01-01}, journal = {Electrochemical and Solid-State Letters}, volume = {9}, number = {12}, pages = {337-339}, keywords = {}, pubstate = {published}, tppubtype = {article} } |
Sekhar, M S; Ramanathan, S: Characterization of copper chemical mechanical polishing (CMP) in nitric acid-hydrazine based slurry for microelectronic fabrication. Thin Solid Films, 504 (1-2), pp. 227-230, 2006, ISSN: 00406090. (Type: Journal Article | Links | BibTeX) @article{Sekhar2006227, title = {Characterization of copper chemical mechanical polishing (CMP) in nitric acid-hydrazine based slurry for microelectronic fabrication}, author = {M S Sekhar and S Ramanathan}, url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-33644896780&doi=10.1016%2fj.tsf.2005.09.128&partnerID=40&md5=86a998eda1ddca4b9cff31630b3330c2}, doi = {10.1016/j.tsf.2005.09.128}, issn = {00406090}, year = {2006}, date = {2006-01-01}, journal = {Thin Solid Films}, volume = {504}, number = {1-2}, pages = {227-230}, keywords = {}, pubstate = {published}, tppubtype = {article} } |
Prasad, Y Nagendra; Ramanathan, S: Role of amino-acid adsorption on silica and silicon nitride surfaces during STI CMP. Electrochemical and Solid-State Letters, 9 (12), pp. 337-339, 2006. (Type: Journal Article | Links | BibTeX) @article{NagendraPrasad2006337b, title = {Role of amino-acid adsorption on silica and silicon nitride surfaces during STI CMP}, author = {Y Nagendra Prasad and S Ramanathan}, url = {https://www.scopus.com/inward/record.uri?eid=2-s2.0-33750472661&doi=10.1149%2f1.2351957&partnerID=40&md5=f47ebc02b680385489244a281bc485ff}, doi = {10.1149/1.2351957}, year = {2006}, date = {2006-01-01}, journal = {Electrochemical and Solid-State Letters}, volume = {9}, number = {12}, pages = {337-339}, keywords = {}, pubstate = {published}, tppubtype = {article} } |